Bongki Lee, Byung-Gyu Ahn, Jaehwan Kim, Minbeom Kim, Jong-Wha Chong. A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology. In 2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012, Seoul, Korea (South), May 20-23, 2012. pages 3262-3265, IEEE, 2012. [doi]
@inproceedings{LeeAKKC12,
title = {A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology},
author = {Bongki Lee and Byung-Gyu Ahn and Jaehwan Kim and Minbeom Kim and Jong-Wha Chong},
year = {2012},
doi = {10.1109/ISCAS.2012.6272021},
url = {http://dx.doi.org/10.1109/ISCAS.2012.6272021},
researchr = {https://researchr.org/publication/LeeAKKC12},
cites = {0},
citedby = {0},
pages = {3262-3265},
booktitle = {2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012, Seoul, Korea (South), May 20-23, 2012},
publisher = {IEEE},
isbn = {978-1-4673-0218-0},
}