Bongki Lee, Byung-Gyu Ahn, Jaehwan Kim, Minbeom Kim, Jong-Wha Chong. A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology. In 2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012, Seoul, Korea (South), May 20-23, 2012. pages 3262-3265, IEEE, 2012. [doi]
Abstract is missing.