Hsu-Chieh Lee, Yao-Wen Chang. A chip-package-board co-design methodology. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 1082-1087, ACM, 2012. [doi]
@inproceedings{LeeC12-10,
title = {A chip-package-board co-design methodology},
author = {Hsu-Chieh Lee and Yao-Wen Chang},
year = {2012},
doi = {10.1145/2228360.2228557},
url = {http://doi.acm.org/10.1145/2228360.2228557},
researchr = {https://researchr.org/publication/LeeC12-10},
cites = {0},
citedby = {0},
pages = {1082-1087},
booktitle = {The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012},
editor = {Patrick Groeneveld and Donatella Sciuto and Soha Hassoun},
publisher = {ACM},
isbn = {978-1-4503-1199-1},
}