Hsu-Chieh Lee, Yao-Wen Chang. A chip-package-board co-design methodology. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 1082-1087, ACM, 2012. [doi]
Abstract is missing.