Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim. Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.