TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM

Youngkwang Lee, Donghyun Han, Sungho Kang. TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM. IEEE Trans. VLSI Syst., 31(4):578-590, April 2023. [doi]

Authors

Youngkwang Lee

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Donghyun Han

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Sungho Kang

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