Youngkwang Lee, Donghyun Han, Sungho Kang. TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM. IEEE Trans. VLSI Syst., 31(4):578-590, April 2023. [doi]
@article{LeeHK23,
title = {TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM},
author = {Youngkwang Lee and Donghyun Han and Sungho Kang},
year = {2023},
month = {April},
doi = {10.1109/TVLSI.2023.3248042},
url = {https://doi.org/10.1109/TVLSI.2023.3248042},
researchr = {https://researchr.org/publication/LeeHK23},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {31},
number = {4},
pages = {578-590},
}