Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang. W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. In IEEE International Test Conference in Asia, ITC-Asia 2020, Taipei, Taiwan, September 23-25, 2020. pages 94-99, IEEE, 2020. [doi]
Abstract is missing.