High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs

Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim. High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Design & Test of Computers, 33(2):17-29, 2016. [doi]

Authors

Manho Lee

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Daniel H. Jung

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Heegon Kim

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Jonghyun Cho

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Joungho Kim

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