Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim. High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Design & Test of Computers, 33(2):17-29, 2016. [doi]
@article{LeeJKCK16,
title = {High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs},
author = {Manho Lee and Daniel H. Jung and Heegon Kim and Jonghyun Cho and Joungho Kim},
year = {2016},
doi = {10.1109/MDAT.2015.2455336},
url = {http://dx.doi.org/10.1109/MDAT.2015.2455336},
researchr = {https://researchr.org/publication/LeeJKCK16},
cites = {0},
citedby = {0},
journal = {IEEE Design & Test of Computers},
volume = {33},
number = {2},
pages = {17-29},
}