Heterogeneous integration technology for MEMS-LSI multi-chip module - researchr publication authors

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Kang-Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi. Heterogeneous integration technology for MEMS-LSI multi-chip module. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]

This author has not been identified. Look up 'Kang-Wook Lee' in GoogleThis author has not been identified. Look up 'Shigeyuki Kanno' in GoogleThis author has not been identified. Look up 'Yuki Ohara' in GoogleThis author has not been identified. Look up 'Kouji Kiyoyama' in GoogleThis author has not been identified. Look up 'Ji Chel Bea' in GoogleThis author has not been identified. Look up 'Takafumi Fukushima' in GoogleThis author has not been identified. Look up 'Tetsu Tanaka' in GoogleThis author has not been identified. Look up 'Mitsumasa Koyanagi' in Google

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