Kang-Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi. Heterogeneous integration technology for MEMS-LSI multi-chip module. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]
@inproceedings{LeeKOKBFTK09,
title = {Heterogeneous integration technology for MEMS-LSI multi-chip module},
author = {Kang-Wook Lee and Shigeyuki Kanno and Yuki Ohara and Kouji Kiyoyama and Ji Chel Bea and Takafumi Fukushima and Tetsu Tanaka and Mitsumasa Koyanagi},
year = {2009},
doi = {10.1109/3DIC.2009.5306599},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306599},
researchr = {https://researchr.org/publication/LeeKOKBFTK09},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}