Hyeokjae Lee, Sanggi Ko, Ho-Joon Suh, Gina Jeong, Jung-Han Yeo, Hye Min Park, Hee-Kyeong Kim, Jong-Kwan Kim, Sung S. Chung, Youngboo Kim, Jisun Park, Hyungsoon Shin. Progressive Degradation Without Physical Failure During Mounting Due to Soft Overstress in Compound HBT for RF, Mobile, and Automotive Applications. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 10, IEEE, 2022. [doi]
Abstract is missing.