Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign

Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen. Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign. In Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007. pages 804-809, IEEE, 2007. [doi]

Abstract

Abstract is missing.