Young-Woo Lee, Hyeonchan Lim, Sungho Kang. Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(10):1759-1763, 2017. [doi]
@article{LeeLK17-5,
title = {Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs},
author = {Young-Woo Lee and Hyeonchan Lim and Sungho Kang},
year = {2017},
doi = {10.1109/TCAD.2016.2611505},
url = {https://doi.org/10.1109/TCAD.2016.2611505},
researchr = {https://researchr.org/publication/LeeLK17-5},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {36},
number = {10},
pages = {1759-1763},
}