Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs

Young-Woo Lee, Hyeonchan Lim, Sungho Kang. Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(10):1759-1763, 2017. [doi]

Abstract

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