Hyun-Woo Lee, Soo-Bin Lim, Junyoung Song, Jabeom Koo, Dae-Han Kwon, Jong-Ho Kang, Yunsaing Kim, Young-Jung Choi, Kunwoo Park, Byong-Tae Chung, Chulwoo Kim. A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon Via (TSV) interface. In 2012 IEEE International Solid-State Circuits Conference, ISSCC 2012, San Francisco, CA, USA, February 19-23, 2012. pages 48-50, IEEE, 2012. [doi]
Abstract is missing.