Hyunsoo Lee, Hyundong Lee, Minseung Shin, Gyuri Shin, Sumin Jeon, Taigon Song. High-throughput PIM (Processing in-Memory) for DRAM using Bank-level Pipelined Architecture. In 20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023. pages 101-102, IEEE, 2023. [doi]
@inproceedings{LeeLSSJS23,
title = {High-throughput PIM (Processing in-Memory) for DRAM using Bank-level Pipelined Architecture},
author = {Hyunsoo Lee and Hyundong Lee and Minseung Shin and Gyuri Shin and Sumin Jeon and Taigon Song},
year = {2023},
doi = {10.1109/ISOCC59558.2023.10396302},
url = {https://doi.org/10.1109/ISOCC59558.2023.10396302},
researchr = {https://researchr.org/publication/LeeLSSJS23},
cites = {0},
citedby = {0},
pages = {101-102},
booktitle = {20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2703-8},
}