High-throughput PIM (Processing in-Memory) for DRAM using Bank-level Pipelined Architecture

Hyunsoo Lee, Hyundong Lee, Minseung Shin, Gyuri Shin, Sumin Jeon, Taigon Song. High-throughput PIM (Processing in-Memory) for DRAM using Bank-level Pipelined Architecture. In 20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023. pages 101-102, IEEE, 2023. [doi]

Abstract

Abstract is missing.