Hayoung Lee, Seung-Ho Shin, Younwoo Yoo, Sungho Kang. TRUST: Through-Silicon via Repair Using Switch Matrix Topology. IEEE Trans. on CAD of Integrated Circuits and Systems, 42(7):2377-2390, July 2023. [doi]
@article{LeeSYK23,
title = {TRUST: Through-Silicon via Repair Using Switch Matrix Topology},
author = {Hayoung Lee and Seung-Ho Shin and Younwoo Yoo and Sungho Kang},
year = {2023},
month = {July},
doi = {10.1109/TCAD.2022.3220711},
url = {https://doi.org/10.1109/TCAD.2022.3220711},
researchr = {https://researchr.org/publication/LeeSYK23},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {42},
number = {7},
pages = {2377-2390},
}