TRUST: Through-Silicon via Repair Using Switch Matrix Topology

Hayoung Lee, Seung-Ho Shin, Younwoo Yoo, Sungho Kang. TRUST: Through-Silicon via Repair Using Switch Matrix Topology. IEEE Trans. on CAD of Integrated Circuits and Systems, 42(7):2377-2390, July 2023. [doi]

Abstract

Abstract is missing.