Yu-Wei Lee, Nur A. Touba. Unified 3D test architecture for variable test data bandwidth across pre-bond, partial stack, and post-bond test. In 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2013, New York City, NY, USA, October 2-4, 2013. pages 184-189, IEEE, 2013. [doi]
Abstract is missing.