Dae-Young Lee, David D. Wentzloff, John P. Hayes. A 900 Mbps single-channel capacitive I/O link for wireless wafer-level testing of integrated circuits. In IEEE Asian Solid-State Circuits Conference, A-SSCC 2011, Jeju, South Korea, November 14-16, 2011. pages 153-156, IEEE, 2011. [doi]
Abstract is missing.