Bond pad and ESD protection structure for 0.25μm/0.18μm RF-CMOS

Domine Leenaerts, Rudolf Velghe. Bond pad and ESD protection structure for 0.25μm/0.18μm RF-CMOS. In José E. Franca, Rudolf Koch, editors, ESSCIRC 2003 - 29th European Solid-State Circuits Conference, Estoril, Portugal, September 16-18, 2003. pages 569-572, IEEE, 2003. [doi]

Abstract

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