Mihai Lefter, George Razvan Voicu, Mottaqiallah Taouil, Marius Enachescu, Said Hamdioui, Sorin Dan Cotofana. Is TSV-based 3D integration suitable for inter-die memory repair?. In Enrico Macii, editor, Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013. pages 1251-1254, EDA Consortium San Jose, CA, USA / ACM DL, 2013. [doi]
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