Dominique Lemoine, Paul-Vahe Cicek, Frederic Nabki, Mourad N. El-Gamal. MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration. In Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, CICC 2008, DoubleTree Hotel, San Jose, California, USA, September 21-24, 2008. pages 189-192, IEEE, 2008. [doi]
Abstract is missing.