Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes. Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectronics Reliability, 54(9-10):1949-1952, 2014. [doi]
Abstract is missing.