Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Jinian Bian, Hannah Honghua Yang, Vijay Pitchumani. Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration. ACM Trans. Design Autom. Electr. Syst., 11(2):325-345, 2006. [doi]
Abstract is missing.