End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs

Dawei Li, Siddhartha Joshi, Ji-Hoon Kim, Seda Ogrenci Memik. End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs. IEEE Trans. VLSI Syst., 25(9):2498-2511, 2017. [doi]

Authors

Dawei Li

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Siddhartha Joshi

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Ji-Hoon Kim

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Seda Ogrenci Memik

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