Dawei Li, Siddhartha Joshi, Ji-Hoon Kim, Seda Ogrenci Memik. End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs. IEEE Trans. VLSI Syst., 25(9):2498-2511, 2017. [doi]
@article{LiJKM17,
title = {End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs},
author = {Dawei Li and Siddhartha Joshi and Ji-Hoon Kim and Seda Ogrenci Memik},
year = {2017},
doi = {10.1109/TVLSI.2017.2699040},
url = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2699040},
researchr = {https://researchr.org/publication/LiJKM17},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {25},
number = {9},
pages = {2498-2511},
}