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Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai. Interconnect in the Era of 3DIC. In IEEE Custom Integrated Circuits Conference, CICC 2022, Newport Beach, CA, USA, April 24-27, 2022. pages 1-5, IEEE, 2022. [doi]
Abstract is missing.