Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs

Zuowei Li, Yuchun Ma, Qiang Zhou, Yici Cai, Yuan Xie, Tingting Huang. Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs. Integration, 46(1):1-9, 2013. [doi]

Abstract

Abstract is missing.