A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging - researchr publication authors

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Junhui Li, Haoliang Zhang, Can Zhou, Zhuo Chen, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu. A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging. IEEE Trans. Industrial Informatics, 15(7):3808-3820, 2019. [doi]

This author has not been identified. Look up 'Junhui Li' in GoogleThis author has not been identified. Look up 'Haoliang Zhang' in GoogleThis author has not been identified. Look up 'Can Zhou' in GoogleThis author has not been identified. Look up 'Zhuo Chen' in GoogleThis author has not been identified. Look up 'Xinxin Chen' in GoogleThis author has not been identified. Look up 'Zhili Long' in GoogleThis author has not been identified. Look up 'Xiaohe Liu' in GoogleThis author has not been identified. Look up 'Wenhui Zhu' in Google

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