Junhui Li, Haoliang Zhang, Can Zhou, Zhuo Chen, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu. A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging. IEEE Trans. Industrial Informatics, 15(7):3808-3820, 2019. [doi]
@article{LiZZCCLLZ19,
title = {A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging},
author = {Junhui Li and Haoliang Zhang and Can Zhou and Zhuo Chen and Xinxin Chen and Zhili Long and Xiaohe Liu and Wenhui Zhu},
year = {2019},
doi = {10.1109/TII.2018.2880900},
url = {https://doi.org/10.1109/TII.2018.2880900},
researchr = {https://researchr.org/publication/LiZZCCLLZ19},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Industrial Informatics},
volume = {15},
number = {7},
pages = {3808-3820},
}