Millimetre-Wave and Terahertz Antennas and Directional Coupler Enabled by Wafer-Level Packaging Platform with Interposer - researchr publication authors

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Yuan Liang, Chirn Chye Boon, Qian Chen 0027, Yangtao Dong. Millimetre-Wave and Terahertz Antennas and Directional Coupler Enabled by Wafer-Level Packaging Platform with Interposer. In IEEE International Symposium on Circuits and Systems, ISCAS 2021, Daegu, South Korea, May 22-28, 2021. pages 1-5, IEEE, 2021. [doi]

This author has not been identified. Look up 'Yuan Liang' in GoogleThis author has not been identified. Look up 'Chirn Chye Boon' in GoogleThis author has not been identified. Look up 'Qian Chen 0027' in GoogleThis author has not been identified. Look up 'Yangtao Dong' in Google

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