Millimetre-Wave and Terahertz Antennas and Directional Coupler Enabled by Wafer-Level Packaging Platform with Interposer

Yuan Liang, Chirn Chye Boon, Qian Chen 0027, Yangtao Dong. Millimetre-Wave and Terahertz Antennas and Directional Coupler Enabled by Wafer-Level Packaging Platform with Interposer. In IEEE International Symposium on Circuits and Systems, ISCAS 2021, Daegu, South Korea, May 22-28, 2021. pages 1-5, IEEE, 2021. [doi]

Abstract

Abstract is missing.