A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs

Huaguo Liang, Danqing Li, Zhao Yang, Tianming Ni, Zhengfeng Huang, Cuiyun Jiang. A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs. In IEEE International Test Conference in Asia, ITC-Asia 2021, Shanghai, China, August 18-20, 2021. pages 1-5, IEEE, 2021. [doi]

Abstract

Abstract is missing.