Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity - researchr publication authors

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Xianhu Liang, Bin Yuan, Yuanyuan Shi, Fei Hui, Xu Jing, Mario Lanza, Felix Palumbo. Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 6-1, IEEE, 2018. [doi]

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