Xianhu Liang, Bin Yuan, Yuanyuan Shi, Fei Hui, Xu Jing, Mario Lanza, Felix Palumbo. Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 6-1, IEEE, 2018. [doi]
@inproceedings{LiangYSHJLP18,
title = {Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity},
author = {Xianhu Liang and Bin Yuan and Yuanyuan Shi and Fei Hui and Xu Jing and Mario Lanza and Felix Palumbo},
year = {2018},
doi = {10.1109/IRPS.2018.8353666},
url = {https://doi.org/10.1109/IRPS.2018.8353666},
researchr = {https://researchr.org/publication/LiangYSHJLP18},
cites = {0},
citedby = {0},
pages = {6},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018},
publisher = {IEEE},
isbn = {978-1-5386-5479-8},
}