Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints

Christina C.-H. Liao, Allen W.-T. Chen, Louis Y.-Z. Lin, Charles H.-P. Wen. Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints. IEEE Trans. VLSI Syst., 21(6):1170-1174, 2013. [doi]

Abstract

Abstract is missing.