11 Cycling of 3D GAA Nanosheet Ferroelectric FET with Stacked HfZrO2 to Homogenize Corner Field Toward Mitigate Dead Zone for High-Density eNVM

C.-Y. Liao, K.-Y. Hsiang, Z.-F. Lou, H.-C. Tseng, C. Y. Lin, Z. X. Li, F.-C. Hsieh, C.-C. Wang, F. S. Chang, W.-C. Ray, Y.-Y. Tseng, Shu-Tong Chang, T.-C. Chen, M. H. Lee. 11 Cycling of 3D GAA Nanosheet Ferroelectric FET with Stacked HfZrO2 to Homogenize Corner Field Toward Mitigate Dead Zone for High-Density eNVM. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 1-2, IEEE, 2022. [doi]

Authors

C.-Y. Liao

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K.-Y. Hsiang

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Z.-F. Lou

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H.-C. Tseng

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C. Y. Lin

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Z. X. Li

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F.-C. Hsieh

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C.-C. Wang

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F. S. Chang

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W.-C. Ray

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Y.-Y. Tseng

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Shu-Tong Chang

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T.-C. Chen

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M. H. Lee

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