Peiyu Liao, Hongduo Liu, Yibo Lin, Bei Yu 0001, Martin D. F. Wong. On a Moreau Envelope Wirelength Model for Analytical Global Placement. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]
Abstract is missing.