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Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen. Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectronics Reliability, 54(11):2555-2563, 2014. [doi]

Authors

Adeline B. Y. Lim

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Andrew C. K. Chang

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Oranna Yauw

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Bob Chylak

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Chee Lip Gan

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Zhong Chen

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