Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen. Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectronics Reliability, 54(11):2555-2563, 2014. [doi]
@article{LimCYCGC14,
title = {Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters},
author = {Adeline B. Y. Lim and Andrew C. K. Chang and Oranna Yauw and Bob Chylak and Chee Lip Gan and Zhong Chen},
year = {2014},
doi = {10.1016/j.microrel.2014.05.005},
url = {http://dx.doi.org/10.1016/j.microrel.2014.05.005},
researchr = {https://researchr.org/publication/LimCYCGC14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {11},
pages = {2555-2563},
}