Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim. Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. In 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015. pages 248-251, IEEE, 2015. [doi]
@inproceedings{LimLJKCLK15,
title = {Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC},
author = {Jaemin Lim and Manho Lee and Daniel H. Jung and Jonghoon J. Kim and Sumin Choi and Hyunsuk Lee and Joungho Kim},
year = {2015},
doi = {10.1109/EMCCompo.2015.7358366},
url = {https://doi.org/10.1109/EMCCompo.2015.7358366},
researchr = {https://researchr.org/publication/LimLJKCLK15},
cites = {0},
citedby = {0},
pages = {248-251},
booktitle = {10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015},
publisher = {IEEE},
isbn = {978-1-4673-7897-0},
}