Abstract is missing.
- Welcome to EMC Compo 2015 [doi]
- Emission reduction in Class D audio amplifiers by optimizing spread spectrum modulationBernd Deutschmann, Gunter Winkler, Timucin Karaca. 1-6 [doi]
- DC/DC converter dead-time variation analysis and far-field radiation estimationTvrtko Mandic, Raul Blecic, Renaud Gillon, Adrijan Baric. 7-12 [doi]
- A highly-digitized automotive CAN transceiver in 0.14µm high-voltage SOI CMOSMatthieu Deloge, Arnoud P. van der Wel, Shishir Goyal, Gerald Kwakernaat, Adrien Schoof. 13-17 [doi]
- EMC and switching loss improvement for fast switching power stages by di/dt, dv/dt optimization with 10ns variable current source gate driverAlexis Schindler, Benno Koeppl, Bernhard Wicht. 18-23 [doi]
- Direct power injection on functional and non-functional signals of SPI EEPROM memoriesMohammed Amellall, Sjoerd Op't Land, Richard Perdriau, Mohammed Ramdani, Ali Ahaitouf, M'hamed Drissi. 24-28 [doi]
- Electromagnetic coupling circuit model of a magnetic near-field probe to a microstrip lineJeremy Raoult, Pierre Payet, Rachid Omarouayache, Laurent Chusseau. 29-33 [doi]
- Bandgap failure study due to parasitic bipolar substrate coupling in Smart Power mixed ICsV. Tomasevic, Alexandre Boyer, Sonia Ben Dhia. 34-38 [doi]
- Fundamental study on randomized processing in cryptographic IC using variable clock against Correlation Power AnalysisMegumi Saito, Takaaki Mizuki, Hideaki Sone, Yu-ichi Hayashi. 39-43 [doi]
- Dynamic multi-parameter response model for SEED analysisMart Coenen, Ming Ye, Huichun Yu. 44-49 [doi]
- Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principleAndy Degraeve, Davy Pissoort, Keith Armstrong. 50-55 [doi]
- Resonance analysis for EMC improvement in integrated circuitsYann Bacher, Nicolas Froidevaux, Philippe Dupre, Henri Braquet, Gilles Jacquemod. 56-60 [doi]
- On-chip Watchdog to monitor RTOS activity in MPSoC exposed to noisy environmentChristofer de Oliveira, Leticia Bolzani Poehls, Fabian Vargas. 61-66 [doi]
- Methodology for interference analysis during early design stages of high-performance mixed-signal ICsSergei Kapora, Marcel Hanssen, Jan Niehof, Quino Sandifort. 67-71 [doi]
- EMI improved chopped operational amplifierAndrea Lavarda, Bernd Deutschmann. 72-76 [doi]
- Analytical approach to study Electromagnetic emission EME contributors on DC/DC applicationsKamel Abouda, Guillaume Aulagnier, Eric Rolland, Marc Cousineau. 77-82 [doi]
- An EMI robust LIN driver with low electromagnetic emissionJohannes Gert Janschitz. 83-86 [doi]
- Arbitrary shape multilayer interconnects EMC modelling and optimizationBoyuan Zhu, Junwei Lu, Mingcheng Zhu, Mei Jiang. 87-91 [doi]
- Analysis of EMI reduction methods of DC-DC buck converterSanghyeok Park, Hai Au Huynh, Soyoung Kim. 92-96 [doi]
- Role of IC substrate and ESD protections in noise propagation: Design and modelling of dedicated test chip in 40 nm technologyMario Rotigni, Mauro Merlo, Martina Cordoni, Paolo Colombo, Valentino Liberali. 97-102 [doi]
- Examination of different adder structures concerning di/dt in a 180nm technologyAndreas Rauchenecker, Timm Ostermann. 103-108 [doi]
- Preliminary study of Automatic Control Gain loop subjected to pulse-modulated radiofrequency interferenceA. Doridant, Jeremy Raoult, Sylvie Jarrix, J.-J. Laurin, P. Hoffmann. 109-114 [doi]
- Susceptibility to EMI of high side current sensors based on chopper OpAmpsPhilipp Schroeter, Fabio Ballarin, Franco Fiori. 115-118 [doi]
- RF immunity investigations of linear DC current regulatorsPhilipp Schroeter, Frank Klotz, Marco Pamato. 119-124 [doi]
- Functional analysis of an integrated communication interface during ESDThomas Ungru, Wolfgang Wilkening, Steffen Walker, Renato Negra. 125-130 [doi]
- Near-field injection on a Safe System Basis Chip at silicon levelBertrand Vrignon, A. Doridant, K. Abouda, Y. Gao, D. Pagnoux, T. Marek. 131-136 [doi]
- Experimental validation of the generalized accurate modelling method for system-level bulk current injection setups up to 1 GHzSergey Miropolsky, Stefan Jahn, Frank Klotz, Stephan Frei. 137-142 [doi]
- Relation between internal terminal voltage and immunity behavior of LDO regulator circuitsHidetoshi Miyahara, Nobuaki Ikehara, Tohlu Matsushima, Takashi Hisakado, Osami Wada. 143-146 [doi]
- Radiated electromagnetic immunity analysis of VCO using IC stripline methodJongtae Hwang, Youngbong Han, Hyunho Park, Wansoo Nah, Soyoung Kim. 147-151 [doi]
- ESD test at component levelLars Glaesser, Sven Koenig. 152-156 [doi]
- Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix methodAhmed Aldabbagh, Alistair Duffy. 157-162 [doi]
- Enhancement of the spatial resolution of near-field immunity mapsAlexandre Boyer, M. Cavarroc. 163-168 [doi]
- RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devicesHyun Ho Park, Dong Gun Kam, Young-Bae Park, Jiseong Kim, Jae-Deok Lim, Hark-Byeong Park, Eakhwan Song. 169-173 [doi]
- Time-domain EMI measurement methodologyShih-Yi Yuan, Ting-Wei Yeh, Yung-Chi Tang, Chiu-Kuo Chen. 174-178 [doi]
- Computational electromagnetics in shielding analysis of system in packageBoyuan Zhu, Junwei Lu, Ling Sun, Haiyan Sun. 179-183 [doi]
- DPI set-up for ICs with differential inputsPriscila Fernandez-Lopez, M. Amara, T. Q. V. Hoang, Frédéric Lafon. 184-189 [doi]
- Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuitJean-Marc Dienot, Emmanuel Batista, Ioav Ramos. 190-195 [doi]
- Characterization of the immunity of integrated circuits (ICs) at wafer levelAndrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann. 196-201 [doi]
- Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC levelManuel Kaufmann, Timm Ostermann. 202-206 [doi]
- Case study on the differences between EMI resilience of analog ICs against continuous wave, modulated and transient disturbancesM. Burak Baran, Wim Dehaene, Hugo Pues, Kristof Stijnen. 207-211 [doi]
- TSV-based current probing structure using magnetic coupling in 2.5D and 3D ICJonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim. 212-215 [doi]
- Analysis of on-chip digital noise coupling path for wireless communication IC test chipSatoshi Tanaka, Peng Fan, Jingyan Ma, Hanae Aoki, Masahiro Yamaguchi, Makoto Nagata, Sho Muroga. 216-221 [doi]
- Radiation characteristics of small loop antenna above perforated finite image planeRaul Blecic, Renaud Gillon, Bart Nauwelaers, Adrijan Baric. 222-227 [doi]
- Simulation of radiated emission during the design phase based on scattering parameter measurementHerbert Hackl, Gunter Winkler, Bernd Deutschmann. 228-231 [doi]
- Large domain validity of MOSFET microwave-rectification responseC. Pouant, J. Raoult, P. Hoffmann. 232-237 [doi]
- EMC performance analysis of a processor/memory system using PCB and Package-On-PackageEtienne Sicard, Alexandre Boyer, Priscila Fernandez-Lopez, An Zhou, Nicolas Marier, Frédéric Lafon. 238-243 [doi]
- Smart power IC macromodeling for DPI analysisH. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, Frank Klotz, M. Brignone, F. Fiori. 244-247 [doi]
- Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D ICJaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim. 248-251 [doi]
- Developing a universal exchange format for Integrated Circuit Emission Model - Conducted EmissionsAbhishek Ramanujan, Etienne Sicard, Alexandre Boyer, Jean-Luc Levant, Christian Marot, Frédéric Lafon. 252-257 [doi]
- Building interchangeable black-box models of integrated circuits for EMC simulationsMarko Magerl, Christian Stockreiter, Oliver Eisenberger, Rainer Minixhofer, Adrijan Baric. 258-263 [doi]