Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim. Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. In 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015. pages 248-251, IEEE, 2015. [doi]
Abstract is missing.