Soo-Bin Lim, Hyun-Woo Lee, Junyoung Song, Chulwoo Kim. A 247 µW 800 Mb/s/pin DLL-Based Data Self-Aligner for Through Silicon via (TSV) Interface. J. Solid-State Circuits, 48(3):711-723, 2013. [doi]
@article{LimLSK13,
title = {A 247 µW 800 Mb/s/pin DLL-Based Data Self-Aligner for Through Silicon via (TSV) Interface},
author = {Soo-Bin Lim and Hyun-Woo Lee and Junyoung Song and Chulwoo Kim},
year = {2013},
doi = {10.1109/JSSC.2013.2242251},
url = {http://doi.ieeecomputersociety.org/10.1109/JSSC.2013.2242251},
researchr = {https://researchr.org/publication/LimLSK13},
cites = {0},
citedby = {0},
journal = {J. Solid-State Circuits},
volume = {48},
number = {3},
pages = {711-723},
}