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Soo-Bin Lim, Hyun-Woo Lee, Junyoung Song, Chulwoo Kim. A 247 µW 800 Mb/s/pin DLL-Based Data Self-Aligner for Through Silicon via (TSV) Interface. J. Solid-State Circuits, 48(3):711-723, 2013. [doi]
Abstract is missing.