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Surface roughness effect on copper-alumina adhesion

Ju Dy Lim, Susan Yeow Su Yi, MinWoo Daniel Rhee, Kam Chew Leong, Chee Cheong Wong. Surface roughness effect on copper-alumina adhesion. Microelectronics Reliability, 53(9-11):1548-1552, 2013. [doi]

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Ju Dy Lim

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Susan Yeow Su Yi

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MinWoo Daniel Rhee

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Kam Chew Leong

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Chee Cheong Wong

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